Credit: Robert Triggs / Android Authority
- Samsung is reportedly working on a new cooling solution for future Exynos smartphone processors.
- This packaging tech is apparently derived from PCs and servers and sees a type of heatsink attached to the top of the processor.
- Work on the tech could be completed by Q4 2024, suggesting the Exynos 2500 could potentially use it.
The Exynos 2400 is a respectable flagship processor, although we did notice it ran a little hotter than the Snapdragon 8 Gen 3. Now, it looks like Samsung has a new cooling solution up its sleeve for future Exynos smartphone chipsets.
The Elec reports that Samsung is working on a new chip packaging technology called fan-out wafer-level package-HPB (FOWLP-HPB). This tech involves attaching a type of heatsink, called a heat path block (HPB), to the top of the chipset.